Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381313 | Semiconductor device and method of manufacturing a semiconductor device | Hee Sung Kim, Yeong Beom Ko, Dong Jean Kim, Sang Seon Oh | 2019-08-13 |
| 10290621 | Method of manufacturing a package-on-package type semiconductor package | Dong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Yeong Beom Ko | 2019-05-14 |