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Pattern decomposition lithography techniques |
Hossam A. Abdallah, Elliot N. Tan, Swaminathan Sivakumar, Oleg Golonzka, Robert M. Bigwood |
2019-11-26 |
| 10409152 |
Pattern decomposition lithography techniques |
Hossam A. Abdallah, Elliot N. Tan, Swaminathan Sivakumar, Oleg Golonzka, Robert M. Bigwood |
2019-09-10 |
| 10338474 |
Underlying absorbing or conducting layer for Ebeam direct write (EBDW) lithography |
Shakul Tandon, Yan Borodovsky, Paul A. Nyhus |
2019-07-02 |
| 10340185 |
Gate aligned contact and method to fabricate same |
Oleg Golonzka, Swaminathan Sivakumar, Tahir Ghani |
2019-07-02 |
| 10319625 |
Metal via processing schemes with via critical dimension (CD) control for back end of line (BEOL) interconnects and the resulting structures |
Paul A. Nyhus, Mohit K. HARAN, Robert M. Bigwood, Deepak S. Rao, Alexander F. Kaplan |
2019-06-11 |
| 10297467 |
Self-aligned via and plug patterning for back end of line (BEOL) interconnects |
Paul A. Nyhus |
2019-05-21 |
| 10211088 |
Self-aligned isotropic etch of pre-formed vias and plugs for back end of line (BEOL) interconnects |
Elliot N. Tan, Paul A. Nyhus, Swaminathan Sivakumar |
2019-02-19 |
| 10204830 |
Previous layer self-aligned via and plug patterning for back end of line (BEOL) interconnects |
Paul A. Nyhus, Elliot N. Tan, Swaminathan Sivakumar |
2019-02-12 |