Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497583 | Method for manufacturing a semiconductor device comprising etching a semiconductor material | Iris Moder, Sophia Friedler, Hans-Joachim Schulze | 2019-12-03 |
| 10373839 | Wafer contacting device, and arrangement and method for electrochemical etching of a wafer | Friedrich Kroener | 2019-08-06 |
| 10325804 | Method of wafer thinning and realizing backside metal structures | Oliver Hellmund, Johannes Baumgartl, Iris Moder, Thomas Neidhart, Hans-Joachim Schulze | 2019-06-18 |
| 10199255 | Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck | Alexander Binter, Bernhard Goller, Christian Grindling | 2019-02-05 |
| 10199372 | Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures | Iris Moder, Oliver Hellmund, Johannes Baumgartl, Annette Saenger, Barbara Eichinger +2 more | 2019-02-05 |