Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497583 | Method for manufacturing a semiconductor device comprising etching a semiconductor material | Sophia Friedler, Ingo Muri, Hans-Joachim Schulze | 2019-12-03 |
| 10325804 | Method of wafer thinning and realizing backside metal structures | Oliver Hellmund, Johannes Baumgartl, Ingo Muri, Thomas Neidhart, Hans-Joachim Schulze | 2019-06-18 |
| 10199372 | Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures | Ingo Muri, Oliver Hellmund, Johannes Baumgartl, Annette Saenger, Barbara Eichinger +2 more | 2019-02-05 |