Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373868 | Method of processing a porous conductive structure in connection to an electronic component on a substrate | Martin Mischitz, Markus Heinrici, Michael Roesner, Caterina Travan, Manfred Schneegans +2 more | 2019-08-06 |
| 10325804 | Method of wafer thinning and realizing backside metal structures | Johannes Baumgartl, Iris Moder, Ingo Muri, Thomas Neidhart, Hans-Joachim Schulze | 2019-06-18 |
| 10199332 | Method of manufacturing a semiconductor device comprising a support element and semiconductor device comprising a support element | Peter Irsigler, Sebastian Schmidt, Hans-Joachim Schulze, Martina Seider-Schmidt | 2019-02-05 |
| 10199372 | Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures | Ingo Muri, Iris Moder, Johannes Baumgartl, Annette Saenger, Barbara Eichinger +2 more | 2019-02-05 |
| 10177033 | Methods for forming a semiconductor device and semiconductor devices | Peter Irsigler, Sebastian Schmidt, Hans-Joachim Schulze, Martina Seider-Schmidt | 2019-01-08 |