MR

Michael Roesner

Infineon Technologies Ag: 1 patents #361 of 980Top 40%
IA Infineon Technologies Austria Ag: 1 patents #111 of 283Top 40%
TW Technische Universität Wien: 1 patents #2 of 29Top 7%
Overall (2019): #138,318 of 560,194Top 25%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10373868 Method of processing a porous conductive structure in connection to an electronic component on a substrate Martin Mischitz, Markus Heinrici, Oliver Hellmund, Caterina Travan, Manfred Schneegans +2 more 2019-08-06
10186458 Component and method of manufacturing a component using an ultrathin carrier Karl Mayer, Evelyn Napetschnig, Michael Pinczolits, Michael Sternad 2019-01-22