MM

Martin Mischitz

Infineon Technologies Ag: 3 patents #107 of 980Top 15%
IA Infineon Technologies Austria Ag: 1 patents #111 of 283Top 40%
TW Technische Universität Wien: 1 patents #2 of 29Top 7%
📍 Wernberg, AT: #3 of 7 inventorsTop 45%
Overall (2019): #48,730 of 560,194Top 9%
4
Patents 2019

Issued Patents 2019

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
10515910 Semiconductor device having a porous metal layer and an electronic device having the same Kurt Matoy 2019-12-24
10373868 Method of processing a porous conductive structure in connection to an electronic component on a substrate Markus Heinrici, Michael Roesner, Oliver Hellmund, Caterina Travan, Manfred Schneegans +2 more 2019-08-06
10340197 Integrated circuit substrate having configurable circuit elements Claudia Sgiarovello, Andrew Christopher Graeme Wood 2019-07-02
10269635 Integrated circuit substrate and method for manufacturing the same Claudia Sgiarovello, Andrew Christopher Graeme Wood 2019-04-23