Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10373839 | Wafer contacting device, and arrangement and method for electrochemical etching of a wafer | Ingo Muri | 2019-08-06 |
| 10373868 | Method of processing a porous conductive structure in connection to an electronic component on a substrate | Martin Mischitz, Markus Heinrici, Michael Roesner, Oliver Hellmund, Caterina Travan +2 more | 2019-08-06 |