RB

Robert L. Bruce

IBM: 11 patents #396 of 11,143Top 4%
WT Waveform Technologies: 2 patents #1 of 13Top 8%
ZE Zeon: 1 patents #62 of 166Top 40%
Overall (2019): #4,919 of 560,194Top 1%
13
Patents 2019

Issued Patents 2019

Patent #TitleCo-InventorsDate
10433789 Method and apparatus for insertion of a sensor Mark Neinast, W. Kenneth Ward, Richard G. Sass, Jon A. Fortuna 2019-10-08
10393642 Pillar array structure with uniform and high aspect ratio nanometer gaps Yann Astier, Joshua T. Smith, Chao Wang, Benjamin H. Wunsch 2019-08-27
10376213 System, method and apparatus for sensor insertion David B. Kreitlow, Isaac Federiuk, Ryan James Polcin, Dennis Slomski, Eric Ward +1 more 2019-08-13
10373704 Reduction of surface nucleotide hybridization by optimizing a biosensor sensing surface area Payel Das, HsinYu Tsai, Sufi Zafar 2019-08-06
10361368 Confined lateral switching cell for high density scaling Takashi Ando, John Rozen 2019-07-23
10312085 Tone inversion integration for phase change memory Matthew J. BrightSky, John M. Papalia, HsinYu Tsai 2019-06-04
10304692 Method of forming field effect transistor (FET) circuits, and forming integrated circuit (IC) chips with the FET circuits John C. Arnold, Sebastian U. Engelmann, Nathan P. Marchack, Hiroyuki Miyazoe, Jeffrey C. Shearer +1 more 2019-05-28
10276384 Plasma shallow doping and wet removal of depth control cap Kevin K. Chan, Sebastian U. Engelmann, Dario L. Goldfarb, Marinus Hopstaken, Mahmoud Khojasteh +3 more 2019-04-30
10236252 Hybrid subtractive etch/metal fill process for fabricating interconnects Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe 2019-03-19
10217661 Articles including ultra low dielectric layers Geraud Jean-Michel Dubois, Gregory M. Fritz, Teddie Peregrino Magbitang, Hiroyuki Miyazoe, Willi Volksen 2019-02-26
10211054 Tone inversion integration for phase change memory Matthew J. BrightSky, John M. Papalia, HsinYu Tsai 2019-02-19
10167443 Wet clean process for removing CxHyFz etch residue Sebastian U. Engelmann, Eric A. Joseph, Mahmoud Khojasteh, Masahiro Nakamura, Satyavolu S. Papa Rao +3 more 2019-01-01
10170361 Thin film interconnects with large grains Cyril Cabral, Jr., Gregory M. Fritz, Eric A. Joseph, Michael F. Lofaro, Hiroyuki Miyazoe +2 more 2019-01-01