Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396469 | Method for manufacturing three-dimensional electronic circuit | Kenneth Vandevoordt, Rebecca Ann DeFronzo | 2019-08-27 |
| 10388615 | Activating reactions in integrated circuits through electrical discharge | Cyril Cabral, Jr., Conal E. Murray, Kenneth P. Rodbell | 2019-08-20 |
| 10354962 | Method and apparatus for a destroy on-demand electrical device | Jeffrey T. Borenstein, Jonathan R. Coppeta, Brett Isenberg | 2019-07-16 |
| 10308828 | Reactively assisted ink for printed electronic circuits | Sara Barron | 2019-06-04 |
| 10262955 | Activating reactions in integrated circuits through electrical discharge | Cyril Cabral, Jr., Conal E. Murray, Kenneth P. Rodbell | 2019-04-16 |
| 10240058 | Reactively assisted ink for printed electronic circuits | Sara Barron | 2019-03-26 |
| 10236252 | Hybrid subtractive etch/metal fill process for fabricating interconnects | Robert L. Bruce, Eric A. Joseph, Hiroyuki Miyazoe | 2019-03-19 |
| 10217661 | Articles including ultra low dielectric layers | Robert L. Bruce, Geraud Jean-Michel Dubois, Teddie Peregrino Magbitang, Hiroyuki Miyazoe, Willi Volksen | 2019-02-26 |
| 10214809 | Energy release using tunable reactive materials | Cyril Cabral, Jr., Kenneth P. Rodbell | 2019-02-26 |
| 10170361 | Thin film interconnects with large grains | Robert L. Bruce, Cyril Cabral, Jr., Eric A. Joseph, Michael F. Lofaro, Hiroyuki Miyazoe +2 more | 2019-01-01 |