Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10247700 | Embedded noble metal electrodes in microfluidics | Huan Hu, Joshua T. Smith, Benjamin H. Wunsch, Daniel J. Solis | 2019-04-02 |
| 10236443 | Combined CMP and RIE contact scheme for MRAM applications | Nathan P. Marchack, Janusz J. Nowak, Eugene J. O'Sullivan | 2019-03-19 |
| 10170361 | Thin film interconnects with large grains | Robert L. Bruce, Cyril Cabral, Jr., Gregory M. Fritz, Eric A. Joseph, Hiroyuki Miyazoe +2 more | 2019-01-01 |