Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10519279 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai | 2019-12-31 |
| 10465089 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Shin Takanezawa, Yasuo Inoue, Kazunaga Sakai | 2019-11-05 |
| 10414943 | Thermosetting resin composition, method for producing resin composition varnish, prepreg and laminate | Yoshihiro Takahashi, Yasuo Kamigata, Masahiro Aoshima, Shinji Tsuchikawa, Masato Miyatake +2 more | 2019-09-17 |
| 10323126 | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package | Tomohiko KOTAKE, Shunsuke Nagai, Shintaro Hashimoto, Shinichiro Abe, Masato Miyatake +1 more | 2019-06-18 |