Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10323126 | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package | Tomohiko KOTAKE, Shunsuke Nagai, Shinichiro Abe, Masato Miyatake, Shin Takanezawa +1 more | 2019-06-18 |