Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10465089 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Hikari Murai, Yasuo Inoue, Kazunaga Sakai | 2019-11-05 |
| 10323126 | Siloxane compound, modified imide resin, thermosetting resin composition, prepreg, film with resin, laminated plate, multilayer printed wiring board, and semiconductor package | Tomohiko KOTAKE, Shunsuke Nagai, Shintaro Hashimoto, Shinichiro Abe, Masato Miyatake +1 more | 2019-06-18 |