Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10465089 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue | 2019-11-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10465089 | Varnish, prepreg, film with resin, metal foil-clad laminate, and printed circuit board | Kouji Morita, Hikari Murai, Shin Takanezawa, Yasuo Inoue | 2019-11-05 |