Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10519279 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Takao Tanigawa, Tomio Fukuda, Yuki Nagai, Hikari Murai | 2019-12-31 |
| 10251265 | Pregreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board | Akiko Kawaguchi, Nozomu Takano, Kazumasa Takeuchi, Shigeru Haeno, Yoshinori Nagai +1 more | 2019-04-02 |