Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10519279 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | Yasuyuki Mizuno, Tomio Fukuda, Yuki Nagai, Hikari Murai | 2019-12-31 |
| 10506705 | Multilayer transmission line plate | Yuusuke Kondou, Etsuo Mizushima, Yuki Nagai, Tomio Fukuda, Tetsurou Irino | 2019-12-10 |