Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468300 | Contacting source and drain of a transistor device | Ruilong Xie, Andre P. Labonte, Lars Liebmann, Daniel Chanemougame, Chanro Park +1 more | 2019-11-05 |
| 10446443 | Integrated circuit product having a through-substrate-via (TSV) and a metallization layer that are formed after formation of a semiconductor device | Himani Suhag Kamineni, Daniel M. Smith, Maxwell Lippitt | 2019-10-15 |
| 10388602 | Local interconnect structure including non-eroded contact via trenches | Su Chen Fan, Andre P. Labonte, Ruilong Xie | 2019-08-20 |
| 10242867 | Gate pickup method using metal selectivity | Guillaume Bouche | 2019-03-26 |