Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446443 | Integrated circuit product having a through-substrate-via (TSV) and a metallization layer that are formed after formation of a semiconductor device | Vimal Kamineni, Daniel M. Smith, Maxwell Lippitt | 2019-10-15 |