Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497728 | Fingerprint sensing chip packaging method and fingerprint sensing chip package | Yuanfei Liu, Hongjun Liu | 2019-12-03 |
| 10490583 | Packaging structure and packaging method | Fangyuan Hong | 2019-11-26 |
| 10418296 | Semiconductor chip package structure and packaging method therefor | Xianglong Liu, Yuanhao Xu | 2019-09-17 |
| 10325946 | Packaging method and package structure for image sensing chip | Zhuowei Wang, Guoliang Xie | 2019-06-18 |
| 10283483 | Packaging method and package structure for image sensing chip | Zhuowei Wang, Guoliang Xie | 2019-05-07 |
| 10276540 | Chip packaging method and chip packaging structure | Ying Yang, Wei-Chung Wang | 2019-04-30 |