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Ying Yang

CC China Wafer Level Csp Co.: 1 patents #4 of 10Top 40%
FL Fih (Hong Kong) Limited: 1 patents #6 of 14Top 45%
JU Jilin University: 1 patents #6 of 25Top 25%
Overall (2019): #61,940 of 560,194Top 15%
3
Patents 2019

Issued Patents 2019

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
10310131 Surface nuclear magnetic resonance system excited by geoelectric field for groundwater detection and field detection method Tingting Lin, Yang Zhang, Hongyu Wang, Kun Zhou, Ling WAN 2019-06-04
10276540 Chip packaging method and chip packaging structure Zhiqi Wang, Wei-Chung Wang 2019-04-30
10245882 Housing for electroic device and method for making same Yu Wang, SHUI-YING CHEN, Bi-Ling Dong 2019-04-02