YX

Yuanhao Xu

CC China Wafer Level Csp Co.: 1 patents #4 of 10Top 40%
Overall (2019): #203,418 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10418296 Semiconductor chip package structure and packaging method therefor Zhiqi Wang, Xianglong Liu 2019-09-17