FH

Fangyuan Hong

CC China Wafer Level Csp Co.: 1 patents #4 of 10Top 40%
Overall (2019): #471,118 of 560,194Top 85%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10490583 Packaging structure and packaging method Zhiqi Wang 2019-11-26