YL

Yuanfei Liu

CC China Wafer Level Csp Co.: 1 patents #4 of 10Top 40%
Overall (2019): #205,472 of 560,194Top 40%
1
Patents 2019

Issued Patents 2019

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10497728 Fingerprint sensing chip packaging method and fingerprint sensing chip package Zhiqi Wang, Hongjun Liu 2019-12-03