ZW

Zhuowei Wang

CC China Wafer Level Csp Co.: 2 patents #2 of 10Top 20%
Overall (2019): #100,585 of 560,194Top 20%
2
Patents 2019

Issued Patents 2019

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10325946 Packaging method and package structure for image sensing chip Zhiqi Wang, Guoliang Xie 2019-06-18
10283483 Packaging method and package structure for image sensing chip Zhiqi Wang, Guoliang Xie 2019-05-07