Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332862 | Semiconductor package structure and method for manufacturing the same | Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO, Meng-Kai SHIH | 2019-06-25 |
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Xiaoming Sui, Vincent Xue | 2019-03-26 |