Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504823 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Jun Lu, Jianxin Ye, Yan Huo, Hua Pan | 2019-12-10 |
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Xiaoming Sui, Bo Chen, Vincent Xue | 2019-03-26 |