Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504823 | Power semiconductor device with small contact footprint and the preparation method | Hongtao Gao, Ming-Chen Lu, Jianxin Ye, Yan Huo, Hua Pan | 2019-12-10 |
| 10396019 | Molded intelligent power module and method of making the same | Zhiqiang Niu, Bum Seok Suh, Wonjin Cho | 2019-08-27 |
| 10177080 | Molded intelligent power module | Zhiqiang Niu, Bum Seok Suh, Wonjin Cho | 2019-01-08 |