Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Bo Chen, Vincent Xue | 2019-03-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242926 | Wafer level chip scale package structure and manufacturing method thereof | Cheow Khoon Oh, Ming-Chen Lu, Bo Chen, Vincent Xue | 2019-03-26 |