Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332862 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Tang-Yuan Chen, Yu-Chang Chen, Jin-Feng Yang, Meng-Kai SHIH | 2019-06-25 |
| 10222209 | Measurement equipment | Seungbae Park, Yu-Ho Hsu, Tai-Yuan Huang | 2019-03-05 |