Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10410942 | Semiconductor device package and method for manufacturing the same | Tsan-Hsien Chen, Ian HU, Shih-Wei Chen, Hui-Chen Hsu | 2019-09-10 |
| 10332862 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Tang-Yuan Chen, Yu-Chang Chen, Chin-Li KAO, Meng-Kai SHIH | 2019-06-25 |