Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522508 | Semiconductor device package and a method of manufacturing the same | Ming-Han Wang, Tsun-Lung Hsieh, Chih-Yi Huang, Chih-Pin Hung | 2019-12-31 |
| 10453802 | Semiconductor package structure, semiconductor device and method for manufacturing the same | — | 2019-10-22 |
| 10410942 | Semiconductor device package and method for manufacturing the same | Tsan-Hsien Chen, Jin-Feng Yang, Shih-Wei Chen, Hui-Chen Hsu | 2019-09-10 |