Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522508 | Semiconductor device package and a method of manufacturing the same | Ian HU, Ming-Han Wang, Chih-Yi Huang, Chih-Pin Hung | 2019-12-31 |
| 10236240 | Low loss substrate for high data rate applications | Yuan-Hsi Chou, Chen-Chao Wang | 2019-03-19 |