Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10522508 | Semiconductor device package and a method of manufacturing the same | Ian HU, Ming-Han Wang, Tsun-Lung Hsieh, Chih-Pin Hung | 2019-12-31 |
| 10332849 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao, Fu-Chen Chu | 2019-06-25 |