Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381300 | Semiconductor device package including filling mold via | Chang-Lin Yeh, Yi-Chi Chen, Sung-Hung Chiang | 2019-08-13 |
| 10332849 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Chih-Yi Huang, Fu-Chen Chu | 2019-06-25 |