Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381300 | Semiconductor device package including filling mold via | Jen-Chieh Kao, Chang-Lin Yeh, Sung-Hung Chiang | 2019-08-13 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381300 | Semiconductor device package including filling mold via | Jen-Chieh Kao, Chang-Lin Yeh, Sung-Hung Chiang | 2019-08-13 |