Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332849 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao, Chih-Yi Huang | 2019-06-25 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332849 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao, Chih-Yi Huang | 2019-06-25 |