Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515806 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chih-Pin Hung | 2019-12-24 |
| 10276382 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, William T. Chen, Chih-Pin Hung | 2019-04-30 |
| 10236240 | Low loss substrate for high data rate applications | Yuan-Hsi Chou, Tsun-Lung Hsieh | 2019-03-19 |
| 10186779 | Semiconductor device package and method of manufacturing the same | Cheng-Yu Ho, Chun-Yen TING, Ming-Fong JHONG, Po-Chih PAN | 2019-01-22 |