Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515806 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2019-12-24 |
| 10276382 | Semiconductor device packages and stacked package assemblies including high density interconnections | John Richard Hunt, Chih-Pin Hung, Chen-Chao Wang | 2019-04-30 |