Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515806 | Semiconductor device packages and stacked package assemblies including high density interconnections | William T. Chen, Chih-Pin Hung, Chen-Chao Wang | 2019-12-24 |
| 10276382 | Semiconductor device packages and stacked package assemblies including high density interconnections | William T. Chen, Chih-Pin Hung, Chen-Chao Wang | 2019-04-30 |