Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10332862 | Semiconductor package structure and method for manufacturing the same | Bo Chen, Yu-Chang Chen, Jin-Feng Yang, Chin-Li KAO, Meng-Kai SHIH | 2019-06-25 |
| 10217649 | Semiconductor device package having an underfill barrier | Jin-Yuan Lai, Ying-Xu Lu, Dao-Long Chen, Kwang-Lung Lin, Chih-Pin Hung +3 more | 2019-02-26 |