Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217649 | Semiconductor device package having an underfill barrier | Jin-Yuan Lai, Tang-Yuan Chen, Dao-Long Chen, Kwang-Lung Lin, Chih-Pin Hung +3 more | 2019-02-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217649 | Semiconductor device package having an underfill barrier | Jin-Yuan Lai, Tang-Yuan Chen, Dao-Long Chen, Kwang-Lung Lin, Chih-Pin Hung +3 more | 2019-02-26 |