Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10344383 | Semiconductor package device and method of manufacturing the same | Chuan-Yung Shih, Yu-Chi Wang, Chin-Feng Wang, Sing-Syuan Shiau, Chun-Wei Shih +3 more | 2019-07-09 |
| 10222209 | Measurement equipment | Seungbae Park, Yu-Ho Hsu, Chin-Li KAO | 2019-03-05 |