Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10344383 | Semiconductor package device and method of manufacturing the same | Chuan-Yung Shih, Tai-Yuan Huang, Yu-Chi Wang, Chin-Feng Wang, Sing-Syuan Shiau +3 more | 2019-07-09 |