Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515884 | Substrate having a conductive structure within photo-sensitive resin | Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Ying Lee, Li-Chuan Tsai, Chih-Cheng Lee | 2019-12-24 |
| 10446411 | Semiconductor device package with a conductive post | Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Ying Lee, Yu-Tzu Peng | 2019-10-15 |
| 10332851 | Semiconductor device package and a method of manufacturing the same | Chung-Chieh Yang, Sheng-Ming Wang | 2019-06-25 |
| 10181438 | Semiconductor substrate mitigating bridging | Chun-Che Lee, Ming-Chiang Lee, Yuan-Chang Su, Chih-Cheng Lee, You-Lung Yen | 2019-01-15 |