Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10217728 | Semiconductor package and semiconductor process | Bernd Karl Appelt, Kay Stefan Essig | 2019-02-26 |
| 10181438 | Semiconductor substrate mitigating bridging | Chun-Che Lee, Ming-Chiang Lee, Yuan-Chang Su, Tien-Szu Chen, Chih-Cheng Lee | 2019-01-15 |