Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424547 | Semiconductor device package and a method of manufacturing the same | Chih-Cheng Lee | 2019-09-24 |
| 10325842 | Substrate for packaging a semiconductor device package and a method of manufacturing the same | Chih-Cheng Lee | 2019-06-18 |
| 10181438 | Semiconductor substrate mitigating bridging | Chun-Che Lee, Ming-Chiang Lee, Tien-Szu Chen, Chih-Cheng Lee, You-Lung Yen | 2019-01-15 |