Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453764 | Molding for large panel fan-out package | Shao-An Chen, Po-Wei LU, Ming Tsung Shen | 2019-10-22 |
| 10446411 | Semiconductor device package with a conductive post | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Ying Lee | 2019-10-15 |