Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515884 | Substrate having a conductive structure within photo-sensitive resin | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee, Li-Chuan Tsai, Chih-Cheng Lee | 2019-12-24 |
| 10508910 | Optical module and method of making the same | Ying-Chung Chen, Hsun-Wei Chan, Lu-Ming Lai | 2019-12-17 |
| 10446411 | Semiconductor device package with a conductive post | Tien-Szu Chen, Sheng-Ming Wang, Yu-Ying Lee, Yu-Tzu Peng | 2019-10-15 |
| 10224298 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Yu-Hsuan Tsai, Yu-Ying Lee, Sheng-Ming Wang, Wun-Jheng Syu | 2019-03-05 |