Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10224298 | Semiconductor package device having glass transition temperature greater than binding layer temperature | Kuang-Hsiung Chen, Yu-Ying Lee, Sheng-Ming Wang, Wun-Jheng Syu | 2019-03-05 |
| 10170658 | Semiconductor package structures and method of manufacturing the same | Lu-Ming Lai | 2019-01-01 |